A [10°C; 70°C] 640×480 17µm pixel pitch TEC-less IR bolometer imager with below 50mK and below 4V power supply

Author

Dupont, Benjamin ; Dupret, A. ; Becker, Steffen ; Hamelin, A. ; Guellec, F. ; Imperinetti, P. ; Rabaud, W.

Author_Institution

LETI, CEA, Grenoble, France

fYear

2013

Firstpage

394

Lastpage

395

Abstract

Used in low-cost thermal imaging, 8-to-12μm infrared micro-bolometer hybrid detectors are very demanding in terms of offset skimming and technological fluctuation compensation: typical offset values are about 100 times larger than the signal, while the fixed-pattern noise (FPN) is about 10 times larger. State-of-the-art image sensors feature noise-equivalent temperature difference (NETD), i.e. thermal resolutions, of about 50mK.

Keywords

bolometers; compensation; image resolution; image sensors; infrared detectors; infrared imaging; FPN; NETD; TEC-less IR bolometer imager; fixed-pattern noise; image sensor; infrared microbolometer hybrid detectors; low-cost thermal imaging; noise-equivalent temperature difference; offset skimming; offset value; size 8 mum to 12 mum; technological fluctuation compensation; temperature 10 C; temperature 70 C; thermal resolution; Bolometers; Mirrors; Noise; Power supplies; Temperature; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International

Conference_Location

San Francisco, CA

ISSN

0193-6530

Print_ISBN

978-1-4673-4515-6

Type

conf

DOI

10.1109/ISSCC.2013.6487785

Filename

6487785