DocumentCode :
1708281
Title :
A 0.1pJ/b 5-to-10Gb/s charge-recycling stacked low-power I/O for on-chip signaling in 45nm CMOS SOI
Author :
Yong Liu ; Ping-Hsuan Hsieh ; Seongwon Kim ; Jae-sun Seo ; Montoye, R. ; Chang, Ly-Yu ; Tierno, Jose ; Friedman, Daniel
Author_Institution :
IBM T. J. Watson, Yorktown Heights, NY, USA
fYear :
2013
Firstpage :
400
Lastpage :
401
Abstract :
Compact low-power signaling schemes to drive on-chip interconnects are needed for processor chips where high-bandwidth data buses connect processor cores and on-chip cache. Since a significant portion of the signaling power is dynamic power spent on driving long wires, reducing the signal swing improves power efficiency [1-3]. In addition, charge-recycling techniques reduce signal swing by stacking circuits with regular and predictable data switching activities, such as logic circuits [4] and clocking circuits [5]. Unlike conventional schemes, low-swing I/O that leverages charge-recycling techniques offers the potential for quadratic power reduction. We present a compact low-power I/O for on-chip signaling using charge-recycling stacked drivers and compact voltage regulators/converters. A receiver circuit modified from a parametric amplifier-based design [6] further improves the area and power efficiency.
Keywords :
CMOS analogue integrated circuits; amplifiers; clocks; driver circuits; electric charge; field buses; integrated circuit interconnections; low-power electronics; silicon-on-insulator; CMOS SOI; bit rate 5 Gbit/s to 10 Gbit/s; charge-recycling stacked driver; charge-recycling stacked low-power I/O; charge-recycling technique; clocking circuit; compact low-power I/O; compact low-power signaling scheme; compact voltage regulators/converters; data switching; driving long wire; dynamic power; high-bandwidth data bus; logic circuit; low-swing I/O; on-chip cache; on-chip interconnects; on-chip signaling; parametric amplifier-based design; power efficiency; processor chip; processor core; quadratic power reduction; receiver circuit; signal swing; signaling power; size 45 nm; stacking circuit; CMOS integrated circuits; Clocks; Energy efficiency; Regulators; Switches; System-on-chip; Voltage control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International
Conference_Location :
San Francisco, CA
ISSN :
0193-6530
Print_ISBN :
978-1-4673-4515-6
Type :
conf
DOI :
10.1109/ISSCC.2013.6487787
Filename :
6487787
Link To Document :
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