Title :
A scalable 0.128-to-1Tb/s 0.8-to-2.6pJ/b 64-lane parallel I/O in 32nm CMOS
Author :
Mansuri, Mozhgan ; Jaussi, J.E. ; Kennedy, J.T. ; Hsueh, Ting-Jen ; Shekhar, Shashi ; Balamurugan, Ganesh ; O´Mahony, Frank ; Roberts, Clive ; Mooney, Randy ; Casper, Bryan
Author_Institution :
Intel, Hillsboro, OR, USA
Abstract :
High-performance computing (HPC) systems demand aggressive scaling of memory and I/O to achieve multiple terabits/sec of bandwidth. Minimizing I/O cost, area and power are crucial to achieving a practically realizable system with such large bandwidth. To meet these needs, we developed a low-power dense 64-lane I/O system with per-port aggregate bandwidth up to 1Tb/s and 2.6pJ/bit power efficiency. We developed a high-density connector and cable, attached to the top side of the package that enables this high interconnect density. A lane-failover mechanism provides design robustness for fault-tolerance. To further optimize power efficiency, the lane data rate scales from 2 to 16Gb/s with non-linear power efficiency of 0.8 to 2.6pJ/bit, providing scalable aggregate bandwidth of 0.128 to 1Tb/s. Highly power scalable circuits such as CMOS clocking and reconfigurable current-mode (CM) or voltage-mode (VM) TX driver enable the 8× bandwidth and 3× power efficiency scalability with aggressive supply voltage scaling (0.6 to 1.08V).
Keywords :
CMOS integrated circuits; clocks; driver circuits; fault tolerance; integrated circuit interconnections; CMOS clocking; aggressive scaling; bit rate 0.128 Tbit/s to 1 Tbit/s; fault tolerance; high-density cable; high-density connector; high-performance computing systems; interconnect density; lane-failover mechanism; low-power dense I/O system; nonlinear power efficiency; power scalable circuits; reconfigurable current-mode TX driver; scalable parallel I/O; size 32 nm; voltage-mode TX driver; Aggregates; Bandwidth; CMOS integrated circuits; Clocks; Connectors; Integrated circuit interconnections; Solid state circuits;
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4673-4515-6
DOI :
10.1109/ISSCC.2013.6487788
