Title :
Enhanced heat spreader based on few-layer graphene intercalated with silane-functionalization molecules
Author :
Haoxue Han ; Kosevich, Yuriy A. ; Yong Zhang ; Johan Liu ; Yifeng Fu ; Lilei Ye ; Volz, Sebastian
Author_Institution :
Lab. EM2C, Chatenay-Malabry, France
Abstract :
We studied the heat-spreading enhancement of supported few-layer graphene by inserting silane-functionalization molecules between graphene sheets. We calculated the overall thermal resistance of graphene-substrate interface and the in-plane thermal conductivity of graphene sheets by equilibrium molecular dynamics simulations. We probed the spectral phonon transmission coefficient by non-equilibrium Green´s function to characterize the local heat conduction through the interface. Our results show that the overal thermal resistance between the substrate graphene and the upper two-layer graphene underwent a three-fold increase by the presence of the molecules, while the local heat conduction from the hot spot to the graphene sheets through the molecules was largely intensified. Furthermore, the in-plane thermal conductivity of the few-layer graphene increased by 60% compared with the supported graphene non-bonded to the substrate through the molecules. This increase is attributed to the refrained cross-plane phonon scattering which in turn reinforces the in-plane heat conduction of the few-layer graphene. In summary, we proved that by inserting silane-functionalization molecules, the few-layer graphene becomes an ideal candidate for heat spreading by guiding heat more efficiently away from the heat source.
Keywords :
Green´s function methods; graphene; molecular dynamics method; phonons; thermal conductivity; thermal resistance; C; enhanced heat spreader; equilibrium molecular dynamics simulations; few-layer graphene; graphene-substrate interface; in-plane thermal conductivity; local heat conduction; nonequilibrium Green´s function method; refrained cross-plane phonon scattering; silane-functionalization molecules; spectral phonon transmission coefficient; thermal resistance; Conductivity; Graphene; Heating; Phonons; Substrates; Thermal conductivity; Thermal resistance;
Conference_Titel :
Thermal Investigations of ICs and Systems (THERMINIC), 2014 20th International Workshop on
Conference_Location :
London
DOI :
10.1109/THERMINIC.2014.6972537