Title :
A 0.54pJ/b 20Gb/s ground-referenced single-ended short-haul serial link in 28nm CMOS for advanced packaging applications
Author :
Poulton, J.W. ; Dally, William J. ; Xi Chen ; Eyles, J.G. ; Greer, T.H. ; Tell, S.G. ; Gray, C.T.
Author_Institution :
Nvidia, Durham, NC, USA
Abstract :
Laminated packages, silicon interposer substrates, and special-purpose package-to-package interconnect [1,5], together with 3D stacking of silicon components [2] enable systems with greatly improved computational power, memory capacity and bandwidth. These package options offer very high-bandwidth channels between chips on the same substrate. We employ ground-referenced single-ended signaling, a charge-pump transmitter, and a co-designed channel to provide communication between multiple chips on one package with high bandwidth per pin and low energy per bit.
Keywords :
CMOS integrated circuits; integrated circuit interconnections; integrated circuit packaging; laminates; transmitters; 3D stacking; CMOS; advanced packaging applications; bit rate 20 Gbit/s; charge-pump transmitter; codesigned channel; computational power; ground-referenced single-ended short-haul serial link; ground-referenced single-ended signaling; high-bandwidth channels; laminated packages; memory capacity; multiple chips; package options; silicon components; silicon interposer substrates; size 28 nm; special-purpose package-to-package interconnect; Attenuation; CMOS integrated circuits; Clocks; Power supplies; Receivers; Transceivers; Transmitters;
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4673-4515-6
DOI :
10.1109/ISSCC.2013.6487789
