DocumentCode :
1708445
Title :
New method for the parameter extraction in Si MOSFETs after hot carrier injection
Author :
Hardillier, S. ; Mourrain, C. ; Bouzid, M.J. ; Ghibaudo, G.
Author_Institution :
CNET, Meylan, France
fYear :
1997
Firstpage :
63
Lastpage :
66
Abstract :
A new parameter extraction method is proposed for the monitoring of hot carrier injection (HCI) degradation in Si MOSFET´s allowing details of the contributions of the channel and access source-drain extension regions to be obtained. Thanks to this method, MDD and LATID architectures have been successfully compared. It is found that MDD devices suffer more from channel degradation, whereas for the LATID devices, the access SD resistance constitutes the worst case parameter
Keywords :
CMOS integrated circuits; MOSFET; elemental semiconductors; hot carriers; integrated circuit reliability; integrated circuit testing; semiconductor device reliability; semiconductor device testing; silicon; 0.25 micron; LATID architecture; MDD architecture; Si; Si MOSFETs; access source-drain extension regions; channel degradation; channel extension regions; hot carrier degradation; hot carrier injection; parameter extraction; submicron CMOS technologies; CMOS technology; Condition monitoring; Degradation; Hot carrier injection; Human computer interaction; MOS devices; MOSFETs; Parameter extraction; Stress; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Test Structures, 1997. ICMTS 1997. Proceedings. IEEE International Conference on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-3243-1
Type :
conf
DOI :
10.1109/ICMTS.1997.589336
Filename :
589336
Link To Document :
بازگشت