Title :
The PCB level ESD immunity study by using 3 dimension ESD scan system
Author :
Wang, Kai ; Pommerenke ; Zhang, Jian Min ; Chundru, Ramachandran
Author_Institution :
EMC Lab., Missouri Univ., Rolla, MO, USA
Abstract :
The use of high-speed logic makes modern electronic systems highly susceptible to electrostatic discharge (ESD). Because of their wider bandwidth, faster digital devices are more susceptible to high frequency ESD transient fields. In the analysis of ESD problems, an exact knowledge of the affected PINs and nets is essential for an optimal solution. A three dimensional ESD scanning system, which has been developed to record the ESD susceptibility map for a printed circuit board, is presented, and the mechanisms that the ESD event couples into the digital devices is studied.
Keywords :
electromagnetic compatibility; electrostatic discharge; immunity testing; printed circuit testing; printed circuits; 3D ESD scanning system; ESD susceptibility map; PCB level ESD immunity; digital devices; electronic systems; electrostatic discharge; high-speed logic; printed circuit board; three dimensional ESD scanning system; transient fields; Cables; Connectors; Electromagnetic compatibility; Electrostatic discharge; Electrostatic interference; Laboratories; Logic devices; Pins; Testing; Voltage;
Conference_Titel :
Electromagnetic Compatibility, 2004. EMC 2004. 2004 InternationalSymposium on
Print_ISBN :
0-7803-8443-1
DOI :
10.1109/ISEMC.2004.1349812