DocumentCode :
1708660
Title :
A time domain approach to estimate current draw from SMT decoupling capacitors
Author :
Zhang, Lin ; Archambeault, Bruce ; Conner, S. ; Knighten, James L. ; Fan, Jun ; Smith, Norman W. ; Alexander, Ray ; Dubroff, Richard E. ; Drewniak, James L.
Author_Institution :
Dept. of Electr. Eng., Missouri Univ., Rolla, MO, USA
Volume :
2
fYear :
2004
Firstpage :
377
Abstract :
A time domain approach to investigate and predict impedances and scattering parameters of a DC power bus is proposed. This approach is based on a cavity model and is achieved using a circuit simulation tool - SPICE. A SPICE-based circuit model for triangular power plane segments is described, verified and applied to simulate both the frequency and time domain characteristics of an irregularly shaped two-layer PCB board. Furthermore, the current draw from a surface mount technology (SMT) decoupling capacitor is simulated and estimated using this approach. Near-field electromagnetic loop probes are used to validate the current estimation qualitatively. Additionally, the frequency bandwidth of this SPICE model is investigated using a network analyzer and time domain reflectometry.
Keywords :
S-parameters; SPICE; capacitors; circuit noise; circuit simulation; electric current; electric impedance; electromagnetic coupling; parameter estimation; printed circuits; surface mount technology; time-domain reflectometry; DC power bus; SMT decoupling capacitors; SPICE; cavity model; circuit simulation tool; current draw estimation; current estimation; frequency bandwidth; frequency domain characteristics; impedances; irregularly shaped two-layer PCB board; near-field electromagnetic loop probes; network analyzer; noise; scattering parameters; surface mount technology; time domain reflectometry; triangular power plane segments; Bandwidth; Capacitors; Circuit simulation; Frequency; Impedance; Probes; SPICE; Scattering parameters; Surface-mount technology; Time domain analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 2004. EMC 2004. 2004 InternationalSymposium on
Print_ISBN :
0-7803-8443-1
Type :
conf
DOI :
10.1109/ISEMC.2004.1349819
Filename :
1349819
Link To Document :
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