DocumentCode :
1708861
Title :
The effect of copper ions on sedimentation rates of erythrocytes
Author :
Jelis, Elias ; Kristol, David ; Arora, Rohit R. ; Spillert, Charles R.
Author_Institution :
New Jersey Inst. of Technol., Newark, NJ, USA
fYear :
2003
Firstpage :
191
Lastpage :
192
Abstract :
Whether copper sulfate affects the sedimentation rate of erythrocytes in blood was investigated. We performed the experiment by placing by 1ml of blood in plastic vials. After that, we added 10μl of 1% CuSO4 solution to an aliquot. Then, we put 10μl of 5% of CuSO4 to 1ml of the same blood into different vial. Following this procedure, we incubated the blood with the various concentrations of CuSO4 to 37 degrees Celcius for ten minutes. Then, we determined the sedimentation rates of the red blood cells (RBCs) for the control, the blood that contained .001% of CuSO4, and the blood that contained .005% of CuSO4. We repeated this experiment with fourteen (n=14) different samples of blood. The results indicate that there was a statistical significance (P<.05) in the sedimentation rate of the blood that contained the .005% of CuSO4 and the control were different In addition, there was a statistical significance (P<.05) that there was a difference in sedimentation rate between the .001% CuSO4 and .005% CuSO4. The results also show that there is no difference in sedimentation between .001% and the control.
Keywords :
biochemistry; blood; cellular biophysics; copper compounds; diseases; haemorheology; sedimentation; 10 min; 37 degC; CuSO4; aliquot; arthritis; control; copper ions; copper sulfate; coronary artery diseases; diseases; erythrocytes; infection; inflammatory system; plastic vials; red blood cells; sedimentation rates; statistical significance; Arthritis; Computational Intelligence Society; Copper; Coronary arteriosclerosis; Diseases; Gravity; In vitro; Oxidation; Plastics; Red blood cells;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Bioengineering Conference, 2003 IEEE 29th Annual, Proceedings of
Print_ISBN :
0-7803-7767-2
Type :
conf
DOI :
10.1109/NEBC.2003.1216058
Filename :
1216058
Link To Document :
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