Development of fine pitch ball grid array

Author

Shibata, Jun ; Horita, Manabu ; Izumi, Naoki ; Shikano, Taketoshi ; Okada, Makio ; Noguchi, Yoshie ; Imamura, Kenji ; Fukunaga, Hideki ; Yasunaga, Masatoshi ; Hirai, Tatsuya ; Hashimoto, Tomoaki ; Takemoto, Yoshitaka

Author_Institution

Mitsubishi Electr. Corp., Hyogo, Japan

fYear

1998

Firstpage

45

Lastpage

49

Abstract

A fine pitch ball grid array (FBGA) has been developed which is suitable mainly for logic devices such as micro control units (MCU) and application specific integrated circuits (ASIC) for consumer portable electronic instruments. The FBGA has a construction in which a die is attached to a glass-epoxy interposer with a single layer conductor. Wire bonding and transfer molding are applied in the same manner as lead frame type packages. The FBGA has a smaller body and higher performance than conventional packages. The package structure, assembly process, performance and reliability test results are introduced

Keywords

application specific integrated circuits; ball grid arrays; composite materials; consumer electronics; fine-pitch technology; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; integrated logic circuits; lead bonding; microcontrollers; moulding; ASIC; FBGA; FBGA body size; FBGA performance; MCU; application specific integrated circuits; assembly process; consumer portable electronic instruments; die attach; fine pitch ball grid array; glass-epoxy interposer; lead frame type packages; logic devices; micro control units; package structure; reliability test; single layer conductor; transfer molding; wire bonding; Application specific integrated circuits; Assembly; Bonding; Conductors; Electronics packaging; Instruments; Integrated circuit packaging; Logic devices; Transfer molding; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

IEMT/IMC Symposium, 2nd 1998

Conference_Location

Tokyo

Print_ISBN

0-7803-5090-1

Type

conf

DOI

10.1109/IEMTIM.1998.704514

Filename

704514