DocumentCode :
1709176
Title :
Space charge phenomena in polyimide films and effects of absorbed water
Author :
Kaneko, K. ; Ozaki, T. ; Nakane, E. ; Mizutani, T.
Author_Institution :
Graduate Sch. of Eng., Nagoya Univ., Japan
Volume :
1
fYear :
2005
Firstpage :
65
Abstract :
Polyimide is widely used as a high-temperature insulating material. Space charge distributions in polyimide (PI) films strongly depend upon electric field, temperature, water content and so on. We observed space charge distributions in PI films with various water contents. When a dc field was applied to as-received PI films or water-treated PI films, positive and negative homo space charges were observed near the respective electrodes at 333 K. In dried PI films, the homo space charges were much reduced, and positive and negative hetero space charges in the bulk were clearly observed. The space charge amounts in water-treated PI films were smaller than in as-received ones, while the current density in water-treated PI film was larger than that in as-received one by two or more orders of magnitude. These suggest not only that the charge injection from the electrode is enhanced by absorbed water but also that absorbed water makes carriers mobile. The decay of space charge was also faster in water-treated PI than in as-received or dried one. This also supports the enhancement of apparent mobilities of carriers in PI by absorbed water.
Keywords :
carrier mobility; charge injection; current density; organic insulating materials; polymer films; sorption; space charge; water; 333 K; H2O; absorbed water; carriers mobility; charge injection; electrode; high-temperature insulating material; homo space charges; negative hetero space charges; polyimide films; positive hetero space charges; space charge phenomena; water treatment; Conducting materials; Current measurement; Electrodes; Humidity; Insulation; Moisture; Polyimides; Space charge; Temperature dependence; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulating Materials, 2005. (ISEIM 2005). Proceedings of 2005 International Symposium on
Print_ISBN :
4-88686-063-X
Type :
conf
DOI :
10.1109/ISEIM.2005.193325
Filename :
1496046
Link To Document :
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