DocumentCode :
1709244
Title :
2D electromagnetic PIC-MCC simulation of the initiation of a large area surface wave sustained plasma source
Author :
Bowers, K.J.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
fYear :
1999
Firstpage :
139
Abstract :
Summary form only given, as follows. A 2D electromagnetic PIC-MCC simulation of a large area plasma source is being performed. In this simulation, the plasma is contained in a metal bound cylindrical region. In one version, the plasma is excited by a ring slot on top of the chamber by oscillatory radial electric fields across the slot. The simulation demonstrates the initiation and fill-in process of a slot excited surface wave sustained plasma source. The steady state density is compared with the predictions of a simple model of the diffusion of the plasma from the source. In the diffusion model, plasma undergoes ambipolar diffusion and is only lost at the walls. Also, the role of electromagnetic effects, such as ponderomotive forces, in the initiation and fill-in are explored.
Keywords :
plasma density; plasma filled waveguides; plasma production; plasma simulation; plasma transport processes; plasma waves; surface waves (fluid); 2D electromagnetic PIC-MCC simulation; ambipolar diffusion; electromagnetic effects; fill-in process; large area plasma source; large area surface wave sustained plasma source; metal bound cylindrical region; oscillatory radial electric fields; ponderomotive forces; ring slot; steady state density; Contracts; Electromagnetic scattering; Plasma density; Plasma simulation; Plasma sources; Plasma waves; Steady-state; Surface waves; Two dimensional displays; US Department of Energy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Science, 1999. ICOPS '99. IEEE Conference Record - Abstracts. 1999 IEEE International Conference on
Conference_Location :
Monterey, CA, USA
ISSN :
0730-9244
Print_ISBN :
0-7803-5224-6
Type :
conf
DOI :
10.1109/PLASMA.1999.829374
Filename :
829374
Link To Document :
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