Title :
An integrated electromagnetic/lumped modeling approach for the simulation of large multi-layer MCM designs
Author :
Hammadi, S. ; Huang, C.-W.P. ; Al-Kuran, S.
Author_Institution :
Anadigics Inc., Warren, NJ, USA
Abstract :
A technique for global simulation of large microwave circuits is presented. Full-wave models of multi-layer PCBs are generated then combined with passive and active element models to generate hybrid electromagnetic/lumped models for MCMs. Measurement and simulation results for a power amplifier (PA) matching circuit are provided to illustrate and validate the method.
Keywords :
circuit simulation; lumped parameter networks; microwave integrated circuits; microwave power amplifiers; multichip modules; printed circuit design; PA matching circuit; active element models; dual band power amplifier; full-wave models; global simulation; hybrid electromagnetic/lumped models; integrated electromagnetic/lumped modeling; large microwave circuits; microwave integrated circuits; multi-layer MCM designs; multi-layer PCB; passive element models; Character generation; Circuit simulation; Computational modeling; Electromagnetic coupling; Electromagnetic modeling; Frequency; Hybrid power systems; Integrated circuit technology; Microwave theory and techniques; Scattering parameters;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2001. IEEE
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-7070-8
DOI :
10.1109/APS.2001.959841
