DocumentCode :
1709882
Title :
Reduced order models for fast time- and frequency-domain analysis of signal paths in HDI boards and packages
Author :
Piesiewicz, Radoslaw ; Keller, Uive ; John, Werner
Author_Institution :
Inst. for Commun. Technol., Tech. Univ. Braunschweig, Germany
Volume :
2
fYear :
2004
Firstpage :
567
Abstract :
The paper presents a modeling concept for signal paths in generalized high density interconnect (HDI) boards and packages. It is based on partitioning the complex HDI structure into generic substructures and on subsequent application of matrix rational approximation and model order reduction methods. The modeling procedure results in reduced order models that are easily applicable to SPICE system level simulations and allow for numerically effective analysis and simulation of high-speed signal behavior in modern multilayer high density passive interconnecting structures.
Keywords :
SPICE; approximation theory; distributed parameter networks; equivalent circuits; frequency-domain analysis; linear network analysis; matrix algebra; printed circuit layout; reduced order systems; time-domain analysis; transmission line theory; HDI boards; HDI packages; SPICE; equivalent circuits; frequency-domain analysis; generalized high density interconnect boards; generic substructures; high-speed circuits; high-speed signal behavior; matrix rational approximation; model order reduction; multilayer high density passive interconnecting structures; reduced order models; signal paths; time-domain analysis; transmission lines model; Analytical models; Bandwidth; Circuit simulation; Computational modeling; Frequency domain analysis; Integrated circuit interconnections; Packaging; Signal analysis; Transmission line discontinuities; Transmission line matrix methods;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 2004. EMC 2004. 2004 InternationalSymposium on
Print_ISBN :
0-7803-8443-1
Type :
conf
DOI :
10.1109/ISEMC.2004.1349860
Filename :
1349860
Link To Document :
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