• DocumentCode
    1710006
  • Title

    Improvement of dielectric strength as microstructural enhancement of XLPE insulation

  • Author

    Shim, Sung-Ik ; Cho, Dae-Hee ; Youn, Bok-Hee ; Takahashi, Toshihiro ; Okamoto, Tatsuki

  • Author_Institution
    EHV Tech. Solution Team, Yokosuka, South Korea
  • Volume
    1
  • fYear
    2005
  • Firstpage
    155
  • Abstract
    With the aim of developing XLPE insulation for extra high voltage cable, we investigated the morphology of cross-linked polyethylene. We used a kind of base materials and additives, and controlled curing condition and amount of additives. The effect of addition of additives on morphology of XLPE such as lamellar density, orientation and additive layer were analyzed using TEM analysis and X-ray diffraction test. For evaluation of breakdown strength of XLPE insulation with additives and base materials, the mold-type XLPE specimens were made and evaluated with Weibull plot parameters, and compared with morphological characteristics. We applied this result to model cable and this model cable was found to have superior dielectric strength and morphological characteristics compared with non additive added model cable.
  • Keywords
    X-ray diffraction; XLPE insulation; electric strength; power cable insulation; transmission electron microscopy; TEM analysis; Weibull plot parameters; X-ray diffraction; XLPE insulation; cross-linked polyethylene; dielectric strength; extra high voltage cable; lamellar density; microstructural enhancement; Additives; Cable insulation; Curing; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Morphology; Polyethylene; Voltage; X-ray diffraction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulating Materials, 2005. (ISEIM 2005). Proceedings of 2005 International Symposium on
  • Conference_Location
    Kitakyushu
  • Print_ISBN
    4-88686-063-X
  • Type

    conf

  • DOI
    10.1109/ISEIM.2005.193360
  • Filename
    1496082