Title :
Electrical insulation and dielectric materials in power electronics devices: today trends and tomorrow needs
Author_Institution :
Lab. de Genie Electrique de Toulouse, CNRS/UPS, Toulouse, France
Abstract :
In the future of power electronics applications, one material has to perform more than one function. Such an objective requires a three-dimensional, multifunctional integration approach, placing materials and interfaces in a central position. The aim of this paper is to highlight this approach.
Keywords :
dielectric materials; insulating materials; power electronics; dielectric materials; electrical insulation; multifunctional integration approach; power electronics devices; Aluminum nitride; Ceramics; Copper; Dielectric materials; Dielectric substrates; Dielectrics and electrical insulation; Multichip modules; Power electronics; Thermal stresses; Voltage;
Conference_Titel :
Electrical Insulating Materials, 2005. (ISEIM 2005). Proceedings of 2005 International Symposium on
Conference_Location :
Kitakyushu
Print_ISBN :
4-88686-063-X
DOI :
10.1109/ISEIM.2005.193362
