DocumentCode
1710060
Title
Electrical insulation and dielectric materials in power electronics devices: today trends and tomorrow needs
Author
Lebey, Th
Author_Institution
Lab. de Genie Electrique de Toulouse, CNRS/UPS, Toulouse, France
Volume
1
fYear
2005
Firstpage
164
Abstract
In the future of power electronics applications, one material has to perform more than one function. Such an objective requires a three-dimensional, multifunctional integration approach, placing materials and interfaces in a central position. The aim of this paper is to highlight this approach.
Keywords
dielectric materials; insulating materials; power electronics; dielectric materials; electrical insulation; multifunctional integration approach; power electronics devices; Aluminum nitride; Ceramics; Copper; Dielectric materials; Dielectric substrates; Dielectrics and electrical insulation; Multichip modules; Power electronics; Thermal stresses; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulating Materials, 2005. (ISEIM 2005). Proceedings of 2005 International Symposium on
Conference_Location
Kitakyushu
Print_ISBN
4-88686-063-X
Type
conf
DOI
10.1109/ISEIM.2005.193362
Filename
1496084
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