Title :
Synthesis and characterization of silica-alumina co-doped polyimide film
Author :
Mingyan, Zhang ; Shujin, Zeng ; Tiequan, Dong ; Jinghe, Zhong ; Yong, Fan ; Xiaohong, Zhang ; Qingquan, Lei
Author_Institution :
Material Sci. & Eng. Coll., Harbin Univ. Sci. Technol., China
Abstract :
A new class of polyimide/silica-alumina (PI/SiO2-Al2O3) composite film was prepared by synthesizing ceramic oligomers through sol-gel reaction using tetraethoxysilane (TEOS) and heteropropyl-aluminium (HPAl) as the inorganic precursors and incorporating them into polyamic acid (PAA) derived from pyromellitic dianhydride (PMDA) and 4,4´-oxydianiline (ODA) in N,N-diethlacetanide (DMAc). The chemical structure of the hybrid polyimide film was characterized by FTIR. And the surface morphology of the film was characterized by AFM. It turned out that a kind of co-doped polyimide film containing a homogeneous dispersion of SiO2 and Al2O3 particles was obtained. And when the content of the inorganic moieties was not beyond 10% SiO2 and 5% Al2O3 (wt%), the size of the ceramic particle was in the range of nano-level, besides, the film was golden and transparent.
Keywords :
Fourier transform spectra; alumina; ceramics; chemical structure; disperse systems; doping; filled polymers; infrared spectra; nanoparticles; particle reinforced composites; particle size; polymer films; silicon compounds; sol-gel processing; surface morphology; 4,4´-oxydianiline; AFM; Al2O3 particles; FTIR; N,N-diethlacetanide; SiO2 particles; ceramic oligomers; chemical structure; composite film; dispersion; hybrid polyimide film; inorganic moieties; nanolevel ceramic particle size; polyamic acid; pyromellitic dianhydride; silica-alumina co-doped polyimide film; sol-gel reaction; surface morphology; transparent film; Aluminum; Ceramics; Materials science and technology; Organic materials; Polyimides; Polymers; Silicon; Temperature; Thermal expansion; Titanium;
Conference_Titel :
Electrical Insulating Materials, 2005. (ISEIM 2005). Proceedings of 2005 International Symposium on
Conference_Location :
Kitakyushu
Print_ISBN :
4-88686-063-X
DOI :
10.1109/ISEIM.2005.193375