Title :
Evaluation of insulation properties of epoxy resin with nano-scale silica particles
Author :
Imai, Takahiro ; Sawa, Furnio ; Ozaki, Takashi ; Shimizu, Toshio ; Kido, Ryouichi ; Kozako, Masahiro ; Tanaka, Toshlkatsu
Author_Institution :
Power & Ind. Syst. R&D Center, Toshiba Corp., Yokohama, Japan
Abstract :
Epoxy resin containing nano-scale silica particles was prepared to evaluate partial discharge degradation and insulation breakdown strength. This material showed superior partial discharge resistance and breakdown strength to epoxy resin without silica particles. Moreover, the focus was on dimension of silica particles and a silane coupling agent to investigate the influence of epoxy/silica interface. Interface bonding by the coupling agent between the nano-scale silica particles and the epoxy resin played more important role on breakdown strength than that of micro-scale silica particles. This result was explained by simple models of nano- and micro-composites.
Keywords :
bonding processes; composite material interfaces; electric breakdown; electric strength; epoxy insulation; filled polymers; nanocomposites; nanoparticles; partial discharges; silicon compounds; SiO2; epoxy resin; epoxy/silica interface; insulation breakdown strength; insulation properties; interface bonding; microcomposites; microscale silica particles; nanocomposites; nanoscale silica particles; partial discharge degradation; partial discharge resistance; silane coupling agent; Casting; Degradation; Electric breakdown; Electrodes; Epoxy resins; Geometry; Insulation; Partial discharges; Polymers; Silicon compounds;
Conference_Titel :
Electrical Insulating Materials, 2005. (ISEIM 2005). Proceedings of 2005 International Symposium on
Conference_Location :
Kitakyushu
Print_ISBN :
4-88686-063-X
DOI :
10.1109/ISEIM.2005.193387
