DocumentCode :
1710712
Title :
Study of the percolation phenomenon of high field volt-ampere characteristic in the composite of low-density polyethylene/nano-SiOx
Author :
Chen, Jiong ; Yin, Yi ; li, Zhe ; Xiao, Dengming
Author_Institution :
Dept. of Electr. Eng., Shanghai Jiao Tong Univ., China
Volume :
1
fYear :
2005
Firstpage :
243
Abstract :
The composite of low-density polyethylene (LDPE)/nano SiOx was prepared by the method of double-solution mixture, and its high field volt-ampere characteristic (HFVAC) was studied The HFVAC of the composite significantly differs to that of pure LDPE. More interesting is that, at the contents of 0.5%-3% of nano SiOx, the percolation phenomena exits in the HFVAC of the composite. At the same time, morphology of the composite was investigated with transmission electron microscope (TEM) and dynamic mechanical analyser (DMA), respectively. It is shown by DMA that the glass transition temperature (Tg), the mechanical loss (tanδ), and the storage modulus E´ of the composite are not linear with the contents of nano SiOx. At last, on the basis of morphology of the composite, the mechanism of the percolation phenomena of HFVAC was discussed.
Keywords :
dielectric losses; dielectric materials; elastic moduli; electrical conductivity; filled polymers; glass transition; high field effects; nanocomposites; nanoparticles; percolation; silicon compounds; transmission electron microscopy; SiOx; TEM; composite morphology; double-solution mixture; dynamic mechanical analyser; glass transition temperature; high field volt-ampere characteristic; low-density polyethylene/nano-SiOx composite; mechanical loss; percolation phenomenon; storage modulus; transmission electron microscope; Current measurement; Electrons; Glass; Magnetic field measurement; Mechanical factors; Morphology; Ovens; Polyethylene; Powders; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulating Materials, 2005. (ISEIM 2005). Proceedings of 2005 International Symposium on
Conference_Location :
Kitakyushu
Print_ISBN :
4-88686-063-X
Type :
conf
DOI :
10.1109/ISEIM.2005.193388
Filename :
1496110
Link To Document :
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