• DocumentCode
    1710712
  • Title

    Study of the percolation phenomenon of high field volt-ampere characteristic in the composite of low-density polyethylene/nano-SiOx

  • Author

    Chen, Jiong ; Yin, Yi ; li, Zhe ; Xiao, Dengming

  • Author_Institution
    Dept. of Electr. Eng., Shanghai Jiao Tong Univ., China
  • Volume
    1
  • fYear
    2005
  • Firstpage
    243
  • Abstract
    The composite of low-density polyethylene (LDPE)/nano SiOx was prepared by the method of double-solution mixture, and its high field volt-ampere characteristic (HFVAC) was studied The HFVAC of the composite significantly differs to that of pure LDPE. More interesting is that, at the contents of 0.5%-3% of nano SiOx, the percolation phenomena exits in the HFVAC of the composite. At the same time, morphology of the composite was investigated with transmission electron microscope (TEM) and dynamic mechanical analyser (DMA), respectively. It is shown by DMA that the glass transition temperature (Tg), the mechanical loss (tanδ), and the storage modulus E´ of the composite are not linear with the contents of nano SiOx. At last, on the basis of morphology of the composite, the mechanism of the percolation phenomena of HFVAC was discussed.
  • Keywords
    dielectric losses; dielectric materials; elastic moduli; electrical conductivity; filled polymers; glass transition; high field effects; nanocomposites; nanoparticles; percolation; silicon compounds; transmission electron microscopy; SiOx; TEM; composite morphology; double-solution mixture; dynamic mechanical analyser; glass transition temperature; high field volt-ampere characteristic; low-density polyethylene/nano-SiOx composite; mechanical loss; percolation phenomenon; storage modulus; transmission electron microscope; Current measurement; Electrons; Glass; Magnetic field measurement; Mechanical factors; Morphology; Ovens; Polyethylene; Powders; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulating Materials, 2005. (ISEIM 2005). Proceedings of 2005 International Symposium on
  • Conference_Location
    Kitakyushu
  • Print_ISBN
    4-88686-063-X
  • Type

    conf

  • DOI
    10.1109/ISEIM.2005.193388
  • Filename
    1496110