Characterization of a low-loss and wide-band (DC to 170 GHz) flip-chip interconnect on an organic substrate

This paper, for the first time, presents the characterization of a very wide-band flip-chip interconnect from DC to 170 GHz on a liquid crystal polymer substrate. The performance is optimized by modeling the structure in a 3-D electromagnetic simulation software. To mitigate the influence of the capacitive effect caused by the flip-chip overlap section, high impedance inductive sections are used. The measured return loss is more than 10 dB, while the insertion loss is less than 0.9 dB/mm for the transmission line and the interconnect across the entire frequency range. The measurements correlate well with simulated results.