1711027

Electrical repair of multilayer ceramic (MLC) substrates

Casey, J. Alec ; Sundlof, B. ; Wassick, Thomas ; Surprenant, R. ; Hamel, Hawey ; Stoller, Herb ; Wiley, Kathleen ; Cohen, Jerome ; Berger, Michael ; Scheider, Donald ; Laplante, M. ; Infantolino, William

IBM Corporation

2003

11

17

CMOS technology; Ceramics; Costs; Isolation technology; Microelectronics; Nonhomogeneous media; Substrates; Transistors; Wire; Wiring;

English

ieee

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

0569-5503

0-7803-7791-5

conf

10.1109/ECTC.2003.1216249

1216249