Title :
Microwave bonding of silicon dies with thin metal films for MEMS applications
Author :
Clendenin, J. ; Tung, Steve ; Budraa, N. ; Mai, John
Author_Institution :
University of Arkansas
Keywords :
Electromagnetic heating; Gold; Infrared heating; Infrared imaging; Micromechanical devices; Numerical analysis; Radio frequency; Semiconductor films; Silicon; Wafer bonding;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216250
