Title :
Embedded IC packaging technology for ultra-thin and highly compact RF module
Author :
Pinel, S. ; Lee, C.-H. ; Yoon, S.-W. ; Nuttinck, S. ; Lim, K. ; Laskar, J.
Author_Institution :
Georgia Institute of Technology
Keywords :
Application specific integrated circuits; Costs; Electronics packaging; Glass; Integrated circuit interconnections; Integrated circuit packaging; Q factor; Radio frequency; Radiofrequency integrated circuits; Voltage-controlled oscillators;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216251
