• DocumentCode
    1711150
  • Title

    Embedded IC packaging technology for ultra-thin and highly compact RF module

  • Author

    Pinel, S. ; Lee, C.-H. ; Yoon, S.-W. ; Nuttinck, S. ; Lim, K. ; Laskar, J.

  • Author_Institution
    Georgia Institute of Technology
  • fYear
    2003
  • Firstpage
    24
  • Lastpage
    29
  • Keywords
    Application specific integrated circuits; Costs; Electronics packaging; Glass; Integrated circuit interconnections; Integrated circuit packaging; Q factor; Radio frequency; Radiofrequency integrated circuits; Voltage-controlled oscillators;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216251
  • Filename
    1216251
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1711150