Title :
Testing technique for early evaluation of compression land grid array connectors
Author_Institution :
IBM Corporation
Keywords :
Connectors; Contact resistance; Costs; Electric resistance; Force measurement; Hardware; Packaging; Reliability; Stress; System testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216253
