DocumentCode
1711214
Title
Lead-free solder assembly: impact and opportunity
Author
Bradley, Edwin
Author_Institution
Motorola
fYear
2003
Firstpage
41
Lastpage
46
Keywords
Alloying; Assembly; Copper alloys; Costs; Environmentally friendly manufacturing techniques; Lead; Legislation; Mechanical factors; Soldering; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216254
Filename
1216254
Link To Document