Title :
Lead-free solder assembly: impact and opportunity
Author_Institution :
Motorola
Keywords :
Alloying; Assembly; Copper alloys; Costs; Environmentally friendly manufacturing techniques; Lead; Legislation; Mechanical factors; Soldering; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216254
