Title :
Creep properties of Sn-rich solder joints
Author :
Morris, J.W., Jr. ; Song, H.G. ; Hua, Fay
Author_Institution :
University of California
Keywords :
Creep; Materials science and technology; Microelectronics; Soldering; Steady-state; Temperature; Testing; Thermal expansion; Thermal stresses; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216256
