Title :
Formation of AgSn plates in Sn-Ag-Cu alloys and optimization of their alloy composition
Author :
Kang, Sung K. ; Won Kyoung Clioi ; Shih, Da-Yuan ; Henderson, Donald W. ; Gossefin, T. ; Sarkliel, A. ; Goldsmith, Cliarlcs ; Punlitz, Karl J.
Author_Institution :
IBM T. J. Watson Research Center
Keywords :
Capacitive sensors; Copper alloys; Electronics cooling; Electronics industry; Fatigue; Industrial electronics; Lead; Plastics; Soldering; Temperature control;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216258
