DocumentCode
1711356
Title
Formation of AgSn plates in Sn-Ag-Cu alloys and optimization of their alloy composition
Author
Kang, Sung K. ; Won Kyoung Clioi ; Shih, Da-Yuan ; Henderson, Donald W. ; Gossefin, T. ; Sarkliel, A. ; Goldsmith, Cliarlcs ; Punlitz, Karl J.
Author_Institution
IBM T. J. Watson Research Center
fYear
2003
Firstpage
64
Lastpage
70
Keywords
Capacitive sensors; Copper alloys; Electronics cooling; Electronics industry; Fatigue; Industrial electronics; Lead; Plastics; Soldering; Temperature control;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216258
Filename
1216258
Link To Document