1711392

Unique phase changes induced by electromigration (EM) in solder joints

Gan, H. ; Xu, G. ; Tu, K.N.

UCLA

2003

71

76

Artificial intelligence; Current density; Electromigration; Electrons; Flip chip; Influenza; Integrated circuit interconnections; Soldering; Temperature; Transistors;

English

ieee

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

0569-5503

0-7803-7791-5

conf

10.1109/ECTC.2003.1216259

1216259