Title :
Error correction for finite semiconductor resistivity in Kelvin test structures
Author :
Holland, Anthony S. ; Reeves, Geoffrey K. ; Harrison, H. Barry
Author_Institution :
R. Melbourne Inst. of Technol., Vic., Australia
Abstract :
The Cross Bridge Kelvin Resistor structure is a commonly used test structure for the extraction of the specific contact resistance of ohmic contacts. Analyses using this structure are generally based on a two-dimensional model which assumes zero voltage drop in the semiconductor layer (in the direction normal to the plane of the contact). This paper uses a three-dimensional analysis to show the magnitude of the errors introduced by this assumption, and illustrates the conditions under which a three-dimensional analysis should be used
Keywords :
contact resistance; electric resistance measurement; electrical conductivity; error correction; finite element analysis; measurement errors; ohmic contacts; semiconductor device metallisation; semiconductor device testing; semiconductor-metal boundaries; 3D analysis; Kelvin test structures; contact resistance extraction; cross bridge Kelvin resistor structure; error correction; finite semiconductor resistivity; ohmic contacts; three-dimensional analysis; two-dimensional model; Bridge circuits; Conductivity; Contact resistance; Current measurement; Error correction; Kelvin; Ohmic contacts; Resistors; Semiconductor device testing; Voltage;
Conference_Titel :
Microelectronic Test Structures, 1997. ICMTS 1997. Proceedings. IEEE International Conference on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-3243-1
DOI :
10.1109/ICMTS.1997.589347