DocumentCode

1711447

Title

Solder joint fatigue life model methodology for 63Sn37Pb and 95.5Sn4Ag0.5Cu materials

Author

Zahn, Bret A.

Author_Institution

ChipPAC Incorporated

fYear

2003

Firstpage

83

Lastpage

94

Keywords

Capacitive sensors; Equations; Fatigue; Finite element methods; Joining materials; Microelectronics; Packaging; Plastics; Predictive models; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216261

Filename

1216261