Title :
Solder joint fatigue life model methodology for 63Sn37Pb and 95.5Sn4Ag0.5Cu materials
Author_Institution :
ChipPAC Incorporated
Keywords :
Capacitive sensors; Equations; Fatigue; Finite element methods; Joining materials; Microelectronics; Packaging; Plastics; Predictive models; Soldering;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216261
