Title :
Study of microvia failure under PCB flexing loads
Author :
Seah, S.K.W. ; Lim, C.T. ; Tan, V.B.C. ; Quah, S.E.
Author_Institution :
National University of Singapore
Keywords :
Assembly; Circuit testing; Copper; Dielectrics; Electronics packaging; Failure analysis; Finite element methods; Flexible printed circuits; Routing; Stress;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216262
