DocumentCode
1711482
Title
Modeling technique for reliability assessment of portable electronic product subjected to drop impact loads
Author
Zhu, Liping
Author_Institution
Sony Ericsson Mobilc Communications, Inc.
fYear
2003
Firstpage
100
Lastpage
104
Keywords
Chip scale packaging; Connectors; Consumer electronics; Failure analysis; Finite element methods; Numerical models; Predictive models; Prototypes; Springs; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216263
Filename
1216263
Link To Document