1711514

Package to board interconnection shear strength (PBISS): effect of surface finish, PWR build-up layer and chip scale package structure

Canumalla, Sridhar ; Yang, Hee-Dong ; Viswanadham, Puligandla

Nokia Mobile Phones

2003

105

112

Assembly; Chip scale packaging; Electronic packaging thermal management; Finite element methods; Materials testing; Mobile handsets; Production; Soldering; Surface cracks; Surface finishing;

English

ieee

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

0569-5503

0-7803-7791-5

conf

10.1109/ECTC.2003.1216264

1216264