Title :
Board level drop test and simulation of TFBGA packages for telecommunication applications
Author :
Tee, Tong Yan ; Ng, Hun Shen ; Lim, Chwee Teck ; Pek, Eric ; Zhong, Zhaowei
Author_Institution :
STMicroclectronics
Keywords :
Electric shock; Electronics packaging; Fatigue; Life estimation; Life testing; Mobile handsets; Predictive models; Semiconductor device packaging; Soldering; System testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216266
