DocumentCode
1711561
Title
Board level drop test and simulation of TFBGA packages for telecommunication applications
Author
Tee, Tong Yan ; Ng, Hun Shen ; Lim, Chwee Teck ; Pek, Eric ; Zhong, Zhaowei
Author_Institution
STMicroclectronics
fYear
2003
Firstpage
121
Lastpage
129
Keywords
Electric shock; Electronics packaging; Fatigue; Life estimation; Life testing; Mobile handsets; Predictive models; Semiconductor device packaging; Soldering; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216266
Filename
1216266
Link To Document