DocumentCode :
1711561
Title :
Board level drop test and simulation of TFBGA packages for telecommunication applications
Author :
Tee, Tong Yan ; Ng, Hun Shen ; Lim, Chwee Teck ; Pek, Eric ; Zhong, Zhaowei
Author_Institution :
STMicroclectronics
fYear :
2003
Firstpage :
121
Lastpage :
129
Keywords :
Electric shock; Electronics packaging; Fatigue; Life estimation; Life testing; Mobile handsets; Predictive models; Semiconductor device packaging; Soldering; System testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN :
0569-5503
Print_ISBN :
0-7803-7791-5
Type :
conf
DOI :
10.1109/ECTC.2003.1216266
Filename :
1216266
Link To Document :
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