Title :
Dynamically linked EM/circuit analysis methodology
Author :
Randhawa, Harpreet ; Williams, Lawrence
Author_Institution :
Ansoft Corp., Pittsburgh, PA, USA
Abstract :
An automated solution for electromagnetic (EM)/circuit co-design is discussed and demonstrated. Examples using a low-temperature co-fired ceramic (LTCC) circuit is given. It is shown that design of complex high-frequency structures can be greatly enhanced by coupling three-dimensional (3D) electromagnetic field simulation with traditional circuit and system simulation.
Keywords :
circuit simulation; electromagnetic compatibility; electromagnetic coupling; electromagnetic fields; 3D electromagnetic field simulation; EM/circuit co-design; LTCC circuit; circuit analysis; circuit simulation; complex high-frequency structures; electromagnetic/circuit co-design; low-temperature co-fired ceramic; system simulation; three-dimensional electromagnetic field simulation; Ceramics; Circuit analysis; Circuit simulation; Coupling circuits; Electromagnetic coupling; Frequency; Inductors; Power system modeling; Scattering parameters; Spirals;
Conference_Titel :
Electromagnetic Compatibility, 2004. EMC 2004. 2004 InternationalSymposium on
Print_ISBN :
0-7803-8443-1
DOI :
10.1109/ISEMC.2004.1349936
