Title :
Solder joint behavior of area array packages in board level drop for handheld devices
Author :
Xie, Dongji ; Arra, Minna ; Yi, Sammy ; Rooney, Dan
Author_Institution :
Flextronics International
Keywords :
Accelerometers; Capacitive sensors; Cellular phones; Electric shock; Electronics packaging; Handheld computers; Life estimation; Plastic packaging; Soldering; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216267
