DocumentCode
1711589
Title
Solder joint behavior of area array packages in board level drop for handheld devices
Author
Xie, Dongji ; Arra, Minna ; Yi, Sammy ; Rooney, Dan
Author_Institution
Flextronics International
fYear
2003
Firstpage
130
Lastpage
135
Keywords
Accelerometers; Capacitive sensors; Cellular phones; Electric shock; Electronics packaging; Handheld computers; Life estimation; Plastic packaging; Soldering; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216267
Filename
1216267
Link To Document