DocumentCode
1711626
Title
Evaluation of low stress dielectrics for board application
Author
Brownlee, Kellee ; Shinotani, K. ; Raj, P. Markondeya ; Bbattacharya, S.K. ; Wong, C.P. ; Tummala, Rao R.
Author_Institution
Georgia Institute of Technology
fYear
2003
Firstpage
136
Lastpage
141
Keywords
Copper; Dielectric liquids; Dielectric materials; Dielectric substrates; Glass; Packaging; Sheet materials; Temperature; Thermal stresses; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216268
Filename
1216268
Link To Document