DocumentCode
1711809
Title
Field-use conditions vs. thermal cycles - a physics-based mapping study
Author
Tunga, Krishna ; Pyland, James ; Pucha, Raghuram V. ; Sitaramai, S.K.
Author_Institution
Georgia Institute of Technology
fYear
2003
Firstpage
182
Lastpage
188
Keywords
Acceleration; Capacitive sensors; Chip scale packaging; Creep; Electronic packaging thermal management; Electronics packaging; Flip chip; Plastics; Qualifications; Thermal degradation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216275
Filename
1216275
Link To Document