DocumentCode
1711882
Title
Reliability assessment of a high performance flip-chip BGA package (organic substrate based) using finite element analysis
Author
Chong, Desmond Y R ; Kapoor, R. ; Sun, Anthony Y S
Author_Institution
United Test & Assernbly Center Ltd.
fYear
2003
Firstpage
207
Lastpage
213
Keywords
Copper; Fatigue; Finite element methods; Flip chip; Packaging; Performance analysis; Soldering; Thermal conductivity; Thermal expansion; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216278
Filename
1216278
Link To Document