Title :
Reliability assessment of a high performance flip-chip BGA package (organic substrate based) using finite element analysis
Author :
Chong, Desmond Y R ; Kapoor, R. ; Sun, Anthony Y S
Author_Institution :
United Test & Assernbly Center Ltd.
Keywords :
Copper; Fatigue; Finite element methods; Flip chip; Packaging; Performance analysis; Soldering; Thermal conductivity; Thermal expansion; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216278
