Title :
Solder joint life prediction model based on the strain energy density criterion
Author :
Guven, Ibrahim ; Kradinov, V. ; Madenci, E. ; Tor, J.L.
Author_Institution :
The University of Arizona
Keywords :
Capacitive sensors; Creep; Electronic packaging thermal management; Electronics packaging; Failure analysis; Fatigue; Finite element methods; Lead; Predictive models; Soldering;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216279
