DocumentCode
1711892
Title
Solder joint life prediction model based on the strain energy density criterion
Author
Guven, Ibrahim ; Kradinov, V. ; Madenci, E. ; Tor, J.L.
Author_Institution
The University of Arizona
fYear
2003
Firstpage
214
Lastpage
220
Keywords
Capacitive sensors; Creep; Electronic packaging thermal management; Electronics packaging; Failure analysis; Fatigue; Finite element methods; Lead; Predictive models; Soldering;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216279
Filename
1216279
Link To Document