DocumentCode
1711915
Title
Finite element analysis to develop a new accelerating test method for board level solder joints for high temperature electronics
Author
Neher, Wolfgang ; Kempe, Wolfgang ; Wondrak, Wolfgang ; Sauer, Wilfried
Author_Institution
Daimler Chrysler AG
fYear
2003
Firstpage
221
Lastpage
228
Keywords
Automotive engineering; Control systems; Electronic equipment testing; Finite element methods; Industrial electronics; Lead; Life estimation; Soldering; Stress; Temperature control;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216280
Filename
1216280
Link To Document