Title :
Flip chip assembly on PCB substrates with coined solder bumps
Author :
Nah, Jae-Woong ; Paik, Kyung W. ; Cho, Soon-Jin ; Kim, Won-Hoe
Author_Institution :
Korea Advanced Institute of Science and Technology
Keywords :
Assembly; Electrical resistance measurement; Flip chip; Gold; Integrated circuit interconnections; Packaging; Printing; Research and development; Testing; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216283
