DocumentCode
1712069
Title
High voltage ionization during plasma immersion ion implantation
Author
Tian, X.B. ; Zeng, Z.M. ; Kwok, T.K. ; Tang, B.Y. ; Chu, P.K.
Author_Institution
Dept. of Phys. & Mater. Sci., City Univ. of Hong Kong, Kowloon, Hong Kong
fYear
1999
Firstpage
205
Abstract
Summary form only given. During the plasma immersion ion implantation (PIII) process, ions are typically created by an external plasma source, such as electron impact glow discharge using hot filaments, radio frequency, electron cyclotron resonance, metal arc, and so on, There is, however, a less obvious ion formation mechanism by the high voltage itself, especially for a long pulse duration or at high working pressure, as shown by the implantation current not decreasing monotonically as predicted by the Child-Langmuir law. A proof of this secondary phenomenon is that the measured total current sometimes increases dramatically in a low vacuum sustained by RF glow discharge. Another example is that the current can gradually rise after a short delay during long pulse, hot filament glow discharge PIII. These phenomena can be attributed to high voltage ionization during the PIII process and are related to the gas pressure, high voltage pulse duration, target size, target materials, and so on. In this paper, we will present supporting experimental data in addition to a theoretical analysis.
Keywords
field ionisation; ion implantation; plasma materials processing; external plasma source; high voltage ionization; high working pressure; hot filament glow discharge; ion formation mechanism; long pulse duration; plasma immersion ion implantation; Current measurement; Cyclotrons; Electrons; Glow discharges; Ionization; Plasma immersion ion implantation; Plasma sources; Radio frequency; Resonance; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Science, 1999. ICOPS '99. IEEE Conference Record - Abstracts. 1999 IEEE International Conference on
Conference_Location
Monterey, CA, USA
ISSN
0730-9244
Print_ISBN
0-7803-5224-6
Type
conf
DOI
10.1109/PLASMA.1999.829496
Filename
829496
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