DocumentCode
1712149
Title
High-throughput Contention-Free concurrent interleaver architecture for multi-standard turbo decoder
Author
Wang, Guohui ; Sun, Yang ; Cavallaro, Joseph R. ; Guo, Yuanbin
Author_Institution
Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
fYear
2011
Firstpage
113
Lastpage
121
Abstract
To meet the higher data rate requirement of emerging wireless communication technology, numerous parallel turbo decoder architectures have been developed. However, the interleaver has become a major bottleneck that limits the achievable throughput in the parallel decoders due to the massive memory conflicts. In this paper, we propose a flexible Double-Buffer based Contention-Free (DBCF) interleaver architecture that can efficiently solve the memory conflict problem for parallel turbo decoders with very high parallelism. The proposed DBCF architecture enables high throughput concurrent interleaving for multi-standard turbo decoders that support UMTS/HSPA+, LTE and WiMAX, with small datapath delays and low hardware cost. We implemented the DBCF interleaver with a 65nm CMOS technology. The implementation of this highly efficient DBCF interleaver architecture shows significant improvement in terms of the maximum throughput and occupied chip area compared to the previous work.
Keywords
3G mobile communication; CMOS integrated circuits; Long Term Evolution; WiMax; codecs; interleaved codes; turbo codes; 65nm CMOS technology; LTE; UMTS-HSPA+; WiMAX; double buffer based contention free interleaver architecture; high throughput concurrent interleaving; high throughput contention free concurrent interleaver architecture; multistandard turbo decoder; parallel turbo decoder architectures; wireless communication technology; Algorithm design and analysis; Clocks; Complexity theory; Decoding; Hardware; Parallel processing; Throughput; HSPA+; LTE; Parallel turbo decoder; UMTS; WiMAX; contention-free; interleaver; multi-standard;
fLanguage
English
Publisher
ieee
Conference_Titel
Application-Specific Systems, Architectures and Processors (ASAP), 2011 IEEE International Conference on
Conference_Location
Santa Monica, CA
ISSN
2160-0511
Print_ISBN
978-1-4577-1291-3
Electronic_ISBN
2160-0511
Type
conf
DOI
10.1109/ASAP.2011.6043259
Filename
6043259
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