DocumentCode :
1712255
Title :
Exploiting structural redundancy of SIMD accelerators for their built-in self-testing/diagnosis and reconfiguration
Author :
Strano, Alessandro ; Bertozzi, Davide ; Grasset, Arnaud ; Yehia, Sami
Author_Institution :
Univ. of Ferrara, Ferrara, Italy
fYear :
2011
Firstpage :
141
Lastpage :
148
Abstract :
Process scaling has given designers billions of transistors to work with. As feature sizes near the atomic scale, extensive variation and wear-out inevitably make margining uneconomical or impossible. In this context, new design approaches are required. The inherent regularity and redundancy of SIMD architectures make them suitable to address the challenges posed by new semiconductor technologies at the architecture level. This paper proposes a built-in self-test/self-diagnosis procedure for a SIMD processor. Concurrent BIST operations are carried out after reset at each PE, thus resulting in scalable test application time with processor size. The key principle consists of exploiting the inherent structural redundancy of the SIMD architecture in a cooperative way, thus strongly reducing the testing framework latency and area overhead. Once the faults are detected, a reconfiguration technique is then proposed in order to preserve correct operation. Testing of single stuck-at faults is performed at-speed in 240 cycles regardless of the accelerator size, with a hardware overhead of less than 10%. Finally, the fault-tolerant tile integrating both BIST, reconfiguration logic and spare PE requires a 25% of total area overhead.
Keywords :
built-in self test; fault tolerant computing; scaling circuits; semiconductor technology; BIST operations; Process scaling; SIMD accelerators; built-in self-diagnosis; built-in self-testing; semiconductor technologies; structural redundancy; Built-in self-test; Circuit faults; Redundancy; Registers; Tiles; BIST; SIMD; fault-tolerance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Application-Specific Systems, Architectures and Processors (ASAP), 2011 IEEE International Conference on
Conference_Location :
Santa Monica, CA
ISSN :
2160-0511
Print_ISBN :
978-1-4577-1291-3
Electronic_ISBN :
2160-0511
Type :
conf
DOI :
10.1109/ASAP.2011.6043262
Filename :
6043262
Link To Document :
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