DocumentCode :
1712256
Title :
High field conduction of the composites of low-density polyethylene/nano SiOx and low-density polyethylene/micrometer SiO2
Author :
Yin, Yi ; Chen, Jiong ; li, Zhe ; Xiao, Dengming
Author_Institution :
Dept. of Electr. Eng., Shanghai Jiao Tong Univ., China
Volume :
2
fYear :
2005
Firstpage :
405
Abstract :
High field conduction of both types of composite of low-density polyethylene (LDPE)/nano SiOx and LDPE/micrometer SiO2 was studied at various temperatures in detail, as well as the effect of the contents of both filler (nano SiOx and micrometer SiO2) on high field conduction. Schottky effect, Poole-Frenkel effect, space-charge-limited conduction (SCLC), Schottky effect, Frenkel effect and ion hopping conduction were used to fit our results. It is pointed out that both Schottky effect and Poole-Frenkel effect do not fit well for all of the high field conduction. However, to some extent, both ion hopping conduction and space charge limited conduction fits the results. The relationship between trap level and its related density was investigated with isothermal current decay. It is shown that traps introducing by the nano SiOx and micrometer SiO2 modulate the high field conduction of both composites.
Keywords :
Poole-Frenkel effect; Schottky effect; filled polymers; hopping conduction; insulating materials; nanocomposites; silicon compounds; space-charge-limited conduction; Poole-Frenkel effect; Schottky effect; SiO2; fillers; high field conduction composites; ion hopping conduction; isothermal current decay; low-density polyethylene; micrometer silicon dioxide; nano SiOx; space-charge-limited conduction; trap level; Conducting materials; Current measurement; Glass; Isothermal processes; Magnetic field measurement; Mechanical factors; Ovens; Polyethylene; Space charge; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulating Materials, 2005. (ISEIM 2005). Proceedings of 2005 International Symposium on
Print_ISBN :
4-88686-063-X
Type :
conf
DOI :
10.1109/ISEIM.2005.193574
Filename :
1496174
Link To Document :
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