Title :
Dielectric characteristics of nano-Ag/SP composite
Author :
Dong, Xiaobing ; Xu, Chuanxiang ; Jiang, Xiuchen
Author_Institution :
Dept. of Electr. Eng., Shanghai Jiao Tong Univ., China
Abstract :
In order to modify material properties, nano Ag (diameter less than 20 nm) was successfully made from Ag colloidal sol and homogenes dispersed into silicone resin modified polyester (SP). The dielectric properties of the composite were studied. Resistivity-temperature characteristic of the composite is some different from that of pure SP. The maximal breakdown voltage of the composite is 112% of that of pure SP and dielectric loss can be 8 times of pure SP at power frequency. Dielectric constants of the composites all increased with various contents of nano Ag. Two types of shallow traps (0.52 eV and 0.62 eV) with trap densities (1.2×1010/cm3 and 2.0×1011/cm3) are found in the composite, which differs significantly from those of pure SP (0.58 eV, 3.1×1010/cm3). Resistivity of the composite is much greater than that of pure SP under cryogenic temperature (77K), which is called Coulomb Blockade effect. From the view of dielectric physics, the different characteristic between the composite and pure SP was discussed and a new concept of nano metal/dielectric materials composite used as device surface protection was introduced.
Keywords :
Coulomb blockade; colloids; composite insulating materials; dielectric losses; dielectric materials; nanocomposites; permittivity; resins; silicone insulation; silver; Coulomb Blockade effect; breakdown voltage; colloidal sol; cryogenic temperature; device surface protection; dielectric characteristics; dielectric constants; dielectric loss; dielectric physics; dielectric properties; material properties; nano metal-dielectric materials; nano-Ag/SP composite; resistivity-temperature characteristic; shallow traps; silicone resin modified polyester; trap densities; Conductivity; Cryogenics; Dielectric constant; Dielectric devices; Dielectric losses; Frequency; Material properties; Physics; Resins; Temperature;
Conference_Titel :
Electrical Insulating Materials, 2005. (ISEIM 2005). Proceedings of 2005 International Symposium on
Print_ISBN :
4-88686-063-X
DOI :
10.1109/ISEIM.2005.193575