Title :
Solder joint reliability of lead-free solder balls assembled with snpb solder paste
Author :
Theuss, Horst ; Kilger, Thomas ; Ort, Thonias
Author_Institution :
Infineon Technologies
Keywords :
Assembly; Chip scale packaging; Degradation; Environmentally friendly manufacturing techniques; Lead; Materials reliability; Qualifications; Semiconductor device packaging; Soldering; Temperature distribution;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216298
