DocumentCode
1712370
Title
Solder joint reliability of lead-free solder balls assembled with snpb solder paste
Author
Theuss, Horst ; Kilger, Thomas ; Ort, Thonias
Author_Institution
Infineon Technologies
fYear
2003
Firstpage
331
Lastpage
337
Keywords
Assembly; Chip scale packaging; Degradation; Environmentally friendly manufacturing techniques; Lead; Materials reliability; Qualifications; Semiconductor device packaging; Soldering; Temperature distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216298
Filename
1216298
Link To Document