Title :
Board level reliability of components with matte tin lead finish
Author :
Nguyen, L. ; Walberg, R. ; Zhou, L. ; Koh, T.
Author_Institution :
National Semiconductor Corp.
Keywords :
Assembly; Connectors; Electronics packaging; Environmentally friendly manufacturing techniques; Lead compounds; Logistics; Semiconductor device packaging; Soldering; Temperature; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216300
