DocumentCode

1712550

Title

Gold bump attachment-of MEM sensor die using thermocompression bonding

Author

Marinis, Thomas F. ; Soucy, J.W.

Author_Institution

Draper Laboratory

fYear

2003

Firstpage

385

Lastpage

391

Keywords

Assembly; Bonding; Ceramics; Glass; Gold; Mechanical sensors; Packaging; Stability; Testing; Thermal sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216306

Filename

1216306